Proceedings of the International scientific and practical conference ―Science and Innovation Today‖ (January 12-14, 2026) / Publisher website: www.naukainfo.com. – Warsaw, Poland, 2026. – 148 p.

10 10.1007/s10854-022-08827-0. URL: https://doi.org/10.1007/s10854-022-08827- 0 3. Yakymovych A., Wodak I., Khatibi G. Hybrid Solder Joints: Viscosity Studies of the Nanocomposite Flux with Fe Nanoparticle Additions [Electronic resource] // Metals. 2025. Vol. 15(1). 93. DOI: 10.3390/met15010093. URL: https://doi.org/10.3390/met15010093 4. Li F., Verdingovas V., Mantis I., Jellesen M. S., Ambat R. Compatibility study of no-clean flux residue and conformal coatings using two electrode electrochemical impedance method [Electronic resource] // Microelectronics Reliability. 2024. Vol. 159. 115452. DOI: 10.1016/j.microrel.2024.115452. URL: https://doi.org/10.1016/j.microrel.2024.115452 5. Lakkaraju A. R., Conseil-Gudla H., Bixenman M., Ambat R. Reflow solder flux residue and humidity interaction: investigation using real PCBA component designs [Electronic resource] // Scientific Reports. 2025. Vol. 15. Article 22496. DOI: 10.1038/s41598-025-05969-z. URL: https://doi.org/10.1038/s41598-025- 05969-z 6. Marquez de Tino U., Kraszewski R., Van Dreel K. Challenges Associated with Non-Clean Liquid Flux Selection to Meet Industry Standards [Electronic resource]. Plexus Corp. URL: https://www.electronics.org/system/files/technical_resource/E39%26S13_01%2 0-%20Ursula%20Marquez.pdf 7. Tolla B., Jean D. Surface Insulation Resistance (SIR) of No-Clean Flux Residues Under Various Surface Mount Components [Electronic resource]. Kester. URL: https://www.circuitinsight.com/pdf/Surface_Insulation_Resistance_No- Clean_Flux_Residues_Under_Various_Surface_Mount_Components_smta.pdf 8. IPC-TM-650. Method 2.6.3.7. Surface Insulation Resistance [Electronic resource]. URL: https://www.electronics.org/sites/default/files/test_methods_docs/2-6-3-7.pdf